Job Description

General Summary: Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work! Our Mission We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you’ll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more. Position: Thermal Engineer As an experienced Thermal Engineer (individual contributor), you will work closely with the platform team developing high-performance servers, collaborating with cross-functional teams, including packaging, electrical, mechanical, and component suppliers. You will be responsible for conducting thermal simulations, testing, and characterization to validate and improve thermal models and solutions for high-performance computing systems. Key Responsibilities Perform die/package/system-level thermal modeling to analyze and optimize server package and system thermals. Support thermal design of packages and systems from concept through detailed design and manufacturing readiness. Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, packaging, system, and customer requirements. Conduct thermal testing to validate and improve thermal models and solutions, enhancing accuracy and robustness. Research thermal management materials and solutions for advanced electronics. Develop and maintain documentation, guidelines, and tools to support design processes and project success. Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers. Minimum Qualifications Master’s degree in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field. 5+ years of hands-on experience in thermal modeling within the high-tech industry. Strong background in heat transfer fundamentals, with a solid understanding of conduction, convection, and radiation. Proficiency with CFD modeling tools (e.g., Celsius EC, Flotherm, Icepak). Understanding of electronics cooling technologies (passive and active). Knowledge of packaging technologies, server design, and thermal management materials. Proven ability to work independently and collaboratively within a cross-functional team environment. Strong technical documentation skills and excellent written and verbal communication. Preferred Qualifications Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field. 10+ years of hands-on experience in thermal modeling within the high-tech industry. Understanding of OCP product designs and industry best practices. Engineering design and industry experience with high-end servers. Expertise in conducting CFD simulations with thermal modeling tools (e.g., Celsius EC, Flotherm, Icepak). Proficiency with thermal testing (e.g., DAQ, LabVIEW, thermocouples, airflow measurements, thermal chambers) for computer hardware. Proficiency in programming languages (e.g., Python, C/C++, MATLAB) for data analysis and tool development. Experience with CAD tools (e.g., SolidWorks, Creo). Qualcomm is an equal opportunity employer. #J-18808-Ljbffr AECOM

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